ElectriPlast -- Belated Patent News!!!

Integral Announces Additional ElectriPlast® US Patents Allowed


By BusinessWire
May 22, 2006 09:15:00 AM ET


[Comment by ElectriPlast Blog Publisher -- Apologies to those looking to this blog to keep up-to-date on pressing events such as news releases. Yesterday, after posting my blog, I spent the evening setting up my new Dell which just came in the post. It wasn't until today that I even realized that news was in the air. At least with this awsome new computer, I'll spend less time watching the blue-screen-of-death, and more providing a decent service to this blog.

Now back to the real story -- PK sends...]


Integral Technologies, Inc. ITKG ("Integral"), announced today that since the beginning of 2006 the Company has had 7 new US patents allowed on applications surrounding its ElectriPlast(TM) technology. These include PlastiCap, PlastiProbe, PlasTenna-No. 6, PlastiRFID, PlastiCooler, PlastiShield and PlastiShrink. This brings the Company's total US patents issued and/or allowed and awaiting issuance to 16. The Company has filed an additional 90 US patent applications surrounding its ElectriPlast(TM) technology between June 2004 and December 2005. Historically, from the date of filing to the approval and issuance of a US Patent, it can be anywhere between 18 and 24 months, approximately.

Commenting on the additional patents allowed, William Robinson, Integral Chairman and CEO said, "The Company is 'batting a thousand' on US patents applied for, and as such it continues to expand and solidify its intellectual property portfolio and expand its asset base surrounding its ElectriPlast(TM) technology. We continue to focus our R&D efforts on identifying applications where ElectriPlast(TM) can mirror the characteristics of metals.

"Every patent allowed on an application of ElectriPlast(TM) is a new licensing opportunity. We anticipate securing more licenses for ElectriPlast(TM) over the remainder of the year."

Integral Technologies

Integral Technologies, Inc. (www.itkg.net) is the developer of an innovative electrically conductive resin-based material called "ElectriPlast(TM)," a highly conductive recipe that can be molded into virtually any shape or dimension associated with the range of plastics, rubbers and other polymers. Our IP consists of ElectriPlast(TM) and over 100 applications of ElectriPlast(TM) in various industries. To date, we have had 16 US patents issued, or allowed and pending issuance, and 90 patents pending on ElectriPlast(TM) applications. Various examples of industries where ElectriPlast(TM) can be used are antennas, shielding, lighting, circuitry, switch actuators, resistors, and medical devices, to name just a few. The company is currently introducing these new products and ElectriPlast(TM) technology on a global scale.

This press release contains "forward-looking statements" within the meaning of Section 27A of the 1933 Securities Act and Section 21E of the 1934 Securities Exchange Act. Actual results could differ materially, as the result of such factors as (1) competition in the markets for the products and services sold by the company, (2) the ability of the company to execute its plans, and (3) other factors detailed in the company's public filings with the SEC. By making these forward-looking statements, the Company can give no assurances that the transaction described in this press release will be successfully completed, and undertakes no obligation to update these statements for revisions or changes after the date of this release.

For more detailed information on the company and the technologies described above please visit our web site at www.itkg.net or contact Shareholder Relations at 888-666-8833 or The Investor Relations Group, at 212-825-3210. To review the company's filings with the SEC, please go to www.sec.gov.

Contact Information: Integral Technologies, Inc. Michael Pound, 888-666-8833