Welcome to the world of ElectriPlast!! This Blog is dedicated to open and honest discussion on Integral Technologies & their intellectual property (IP) known as ElectriPlast. Discussions on this Blog include: Historical Perspectives (Integral & its Products); Management Profiles; Patents; Production Issues; Tech Spin-offs; Product Speculations and Time Tables; The Game Plan; Media Relations; Corp Supporters; Shareholder Impressions; & the Latest News.

My Photo
Location: Bavaria, Germany

I am a retired US Government analyst, currently residing in Germany. I am also a shareholder in the company called Integral Technologies (OTCBB: ITKG), and have a desire to enlighten and share its great and still emerging story. I am well read, focused and appreciate challenging interactions which spark creativity and develop enlightenment. That is why I created the ElectriPlast Blog, and the reason I am here.

December 10, 2006

ElectriPlast: The Future is Close at Hand...



By: Plastemart.com©
8 December 2006

Demand for conductive electronic polymer products to grow globally (8-12-2006)

Global demand for conductive electronic polymer products is slated to expand by 14.5% pa until 2008, according to a research by Frost & Sullivan. The electronics industry could witness many changes due to introduction of plastic electronics based on inherently conductive polymers (ICPs) and flexible substrates.Currently, the industry heavily relies on plastic as low-cost solution for thermal management in devices with its insulation and conductive properties. Recently developed conductive transparent polymers also function as OLED in displays. Future products include roll-up displays for computers and cellp hones, flexible solar panels for power portable equipment, as well as ultralow-cost RFID tags. New materials such as carbon nanotubes and organic molecules, with conducting and semi-conducting properties, are set to bring in sophisticated plastic electronic displays for cell phones and portable devices as per the report.

The ongoing trend toward miniaturization and the consequent demand for high-performance plastics that provide tough, stable parts with thin walls will intensify the search for specialty polymers. Compact and complex PCBs with rising operating temperatures are pushing researchers to focus on the thermal management capabilities of plastics used in electronic devices. In addition to new resins, additives and fillers to meet thin-wall and high-temperature requirements for molded parts, there is a need for more-efficient heat sinks that that are used to cool semiconductors, reported Frost & Sullivan.

Moreover, thermally conductive thermoplastics are also eyed as alternatives for aluminium and copper as development materials for heat sinks for electronics. Meanwhile, the growing use of lead-free soldering to comply with the RoHS directive is said to add to the demand for plastics with exceptional thermal management properties. Hence, new plastic materials must accommodate higher soldering temperatures of about 250°C to 260°C, especially for electronic parts that undergo surface-mount reflow soldering. Compounds made of high-temperature thermoplastics such as liquid crystal polymer and polyethersulfone used in molded interconnect devices and low-k dielectric polymers in semiconductor fabrication are also expected to register strong growth.

This report can be found at -- http://www.plastemart.com/plasticnews_desc.asp?news_id=9604&P=P#


Post a Comment

<< Home