Welcome to the world of ElectriPlast!! This Blog is dedicated to open and honest discussion on Integral Technologies & their intellectual property (IP) known as ElectriPlast. Discussions on this Blog include: Historical Perspectives (Integral & its Products); Management Profiles; Patents; Production Issues; Tech Spin-offs; Product Speculations and Time Tables; The Game Plan; Media Relations; Corp Supporters; Shareholder Impressions; & the Latest News.

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I am a retired US Government analyst, currently residing in Germany. I am also a shareholder in the company called Integral Technologies (OTCBB: ITKG), and have a desire to enlighten and share its great and still emerging story. I am well read, focused and appreciate challenging interactions which spark creativity and develop enlightenment. That is why I created the ElectriPlast Blog, and the reason I am here.

August 08, 2007

ElectriPlast: Diversifying Applications


the range of


Future Uses.

By © 2007 BusinessWire
August 08, 2007
9:30:00 AM ET

Integral Announces ElectriPlast™ US Patent Update

Integral Technologies, Inc. ITKG ("Integral"), announced today that its impressive US patent portfolio anchored by its award-winning ElectriPlast™ technology has now grown to 31 patents issued and/or allowed but awaiting issuance, and 87 pending.

The portfolio is a centerpiece of Integral's strategy to aggressively develop, protect, and market its innovations. Integral's patent holdings encompass a broad range of ElectriPlast™ developments including core technology, key applications and related micron conductive fiber technology.

Integral's patent portfolio is pivotal to its strategies for marketing, manufacturing and licensing. Integral is now aggressively marketing ElectriPlast™ molding material to many end-product manufacturers. As these products come on-line, direct sales of ElectriPlast™ molding materials will grow. Integral's ownership of fundamental ElectriPlast™ patents -- both for the ElectriPlast™ material and for applications based on that material -- will enable Integral to maintain strong material pricing leverage. Integral, with its manufacturing partner, Jasper Rubber Products Inc. is rapidly developing manufacturing capacity to meet the anticipated market for its ElectriPlast™ molding material. Integral's portfolio protects its position, and that of its partners, as they confidently invest in capacity gains. As the technology matures, additional patent filings should capture additional innovations to further solidify Integral's position in the market. Finally, the portfolio provides a storehouse of future licensing opportunities that will grow in value with the ElectriPlast™ market.

The patent portfolio may be divided into three main types of patents -- core technology, key applications, and related micron conductive fiber technology. The core technology patents include composition and techniques for manufacturing ElectriPlast™ moldable capsules. A first core technology patent was recently issued while several patents are pending. Development of high volume ElectriPlast™ manufacturing capability has spawned new core technology innovations. These innovations are constantly evaluated for viability as new patent filings. Some innovations may be maintained as trade secrets where appropriate.

Numerous key applications exploit the unique properties of the ElectriPlast™ material. Integral's patent portfolio includes patents drawn to key applications that are seen as fundamental to future product developments. For example, ElectriPlast™ is ideally suited to many antenna applications due to its unique combination of conductivity and resonance capability. Therefore, several patents have been filed that incorporate ElectriPlast™ into antenna designs and that claim numerous innovations optimally suited to ElectriPlast™ antennas. Additional key applications for ElectriPlast™ include, for example, heating elements, thermal management (cooling) devices, electromagnetic energy shielding and absorption devices, sparking devices, magnetic devices, conductor devices and acoustic devices.

Further, patents have been filed for numerous key applications where ElectriPlast™ is an excellent replacement for existing materials such as metal. Key material replacement patents include, for example, automotive components, airplane components and medical devices.

Further research and development efforts at Integral have resulted in additional exciting and innovative technologies. ElectriOnix™ and ElectriPonix™ are two technologies based on the same micron conductive fiber as ElectriPlast™. The portfolio includes patent applications for ElectiOnix™ and ElectriPonix™. In ElectriOnix™ technology, excellent heating elements are formed by bundling micron conductive fiber strands. Fiber bundles containing thousands of micron fibers strands exhibit excellent conductivity due to their large cumulative surface conduction area. However, the micron diametric size of each fiber strand creates a very small per strand heat capacity. As a result, ElectiOnix™ heating elements exhibit very rapid heating and cooling.

In ElectriPonix™ technology, bundles of micron conductive fiber are coated with resin-based material to create an exceptional wiring product. ElectriPonix™ wiring may be in a variety of applications including power distribution, signal communication, and heating. In addition, the micron conductive fiber bundle technology of ElectriOnix™ or ElectriPonix™ may be combined with the conductive ElectriPlast™ molding material to create other unique products.

Integral Technologies

Integral Technologies, Inc. (www.itkg.net) is the developer of an innovative electrically conductive resin-based material called "ElectriPlast™," a highly conductive recipe that can be molded into virtually any shape or dimension associated with the range of plastics, rubbers and other polymers. Our IP consists of ElectriPlast™ and thousands of different applications pertinent to a wide variety of industries. To date, we have had 31 US patents issued, or allowed and pending issuance, and 87 patents pending on ElectriPlast™ applications. Various examples of industries where ElectriPlast™ can be used are antennas, shielding, lighting, circuitry, switch actuators, resistors, and medical devices, to name just a few. The company is currently introducing these new products and ElectriPlast™ technology on a global scale.

This press release contains "forward-looking statements" within the meaning of Section 27A of the 1933 Securities Act and Section 21E of the 1934 Securities Exchange Act. Actual results could differ materially, as the result of such factors as (1) competition in the markets for the products and services sold by the company, (2) the ability of the company to execute its plans, and (3) other factors detailed in the company's public filings with the SEC. By making these forward-looking statements, the Company can give no assurances that the transaction described in this press release will be successfully completed, and undertakes no obligation to update these statements for revisions or changes after the date of this release.

For more detailed information on the company and the technologies described above please visit our web site at www.itkg.net or contact Shareholder Relations at 888-666-8833 or The Investor Relations Group, at 212-825-3210. To review the company's filings with the SEC, please go to www.sec.gov. Contact Information: Integral Technologies, Inc. Michael Pound, 888-666-8833.


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